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mpx5050 rev 11, 03/2010 freescale semiconductor ? freescale semiconductor, inc. , 2007-2010. all rights reserved. pressure integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and calibrated the mpxx5050 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor de signed for a wide range of applications, but particularly those employing a micr ocontroller or microprocessor with a/d inputs. this patented, single elem ent transducer combines advanced micromachining techniques, thin-film me tallization, and bipolar processing to provide an accurate, high level analog out put signal that is proportional to the applied pressure. features ? 2.5% maximum error over 0 to 85 c ? ideally suited for mi croprocessor or microcontroller-based systems ? temperature compensated over -40 to +125 c ? patented silicon shear stress strain gauge ? durable epoxy unibody element ? easy-to-use chip carrier option ordering information device name case no. # of ports pressure type device marking none single dual gauge differential absolute unibody package (mpx5050 series) mpx5050d 867 ? ? mpx5050d mpx5050dp 867c ? ? mpx5050dp mpx5050gp 867b ? ? mpx5050gp mpx5050gp1 867b ? ? mpx5050gp small outline package (mpxv5050 series) MPXV5050GP 1369 ? ? MPXV5050GP mpxv5050dp 1351 ? ? mpxv5050dp mpxv5050gc6u 482a ? ? mpxv5050g mpxv5050gc6t1 482a ? ? mpxv5050g small outline package (media resistant gel) (mpvz5050 series) mpvz5050gw7u 1560 ? ? mz5050gw mpx5050 series 0 to 50 kpa (0 to 7.25 psi) 0.2 to 4.7 v output mpxv5050 mpvz5050
mpx5050 sensors 2 freescale semiconductor pressure small outline packages unibody packages MPXV5050GP case 1369-01 mpxv5050dp case 1351-01 mpxv5100gc6u case 482a-01 mpx5050gp case 867b-04 mpx5050dp case 857c-05 mpvz5050gw7u case 1560-03 mpx5050d case 867-08
mpx5050 sensors freescale semiconductor 3 pressure operating characteristics table 1. operating characteristics ( v s = 5.0 vdc, t a = 25c unless otherwise noted, p1 > p2. decoupling circuit shown in figure 4 required to meet electrical specifications.) characteristic symbol min typ max unit pressure range (1) 1. 1.0 kpa (kilopascal) equals 0.145 psi. p op 0?50kpa supply voltage (2) 2.device is ratiometric within this specified excitation range. v s 4.75 5.0 5.25 vdc supply current i o ? 7.0 10 madc minimum pressure offset (3) (0 to 85 c) @ v s = 5.0 volts 3.offset (v off ) is defined as the output voltage at the minimum rated pressure. v off 0.088 0.2 0.313 vdc full scale output (4) (0 to 85 c) @ v s = 5.0 volts 4.full scale output (v fso ) is defined as the output voltage at the maximum or full rated pressure. v fso 4.587 4.7 4.813 vdc full scale span (5) (0 to 85 c) @ v s = 5.0 volts 5.full scale span (v fss ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. v fss ?4.5?vdc accuracy (6) (0 to 85 c) 6.accuracy (error budget) consists of the following: linearity: output deviation from a straight line relations hip with pressure over the specified pressure range. temperature hysteresis: output deviation at any temperature within the operating temperature range, after the temperature is cy cled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. pressure hysteresis: output deviation at any pressure within t he specified range, when this pressure is cycled to and from the minimum or maximum rated pressure at 25 c. tcspan: output deviation over the temperature range of 0 to 85 c, relative to 25 c. tcoffset: output deviation with minimum pressu re applied, over the temperature range of 0 to 85 c, relative to 25 c. variation from nominal: the variation from nominal val ues, for offset or full scale span, as a percent of v fss at 25 c. ??? 2.5 %v fss sensitivity v/p ? 90 ? mv/kpa response time (7) 7.response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. t r ?1.0?ms output source current at full scale output i o+ ?0.1?madc warm-up time (8) 8.warm-up time is defined as the time required for the product to meet the specified output vo ltage after the pressure has been stabilized. ??20?ms offset stability (9) 9.offset stability is the product's output deviation when subjected to 1000 hours of pu lsed pressure, temperature cycling with bias test. ?? 0.5 ? %v fss
mpx5050 sensors 4 freescale semiconductor pressure maximum ratings figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. figure 1. fully integrated pressure sensor schematic table 2. maximum ratings (1) 1.exposure beyond the specified limits may cause permanent damage or degradation to the device. rating symbol value unit maximum pressure (p1 > p2) p max 200 kpa storage temperature t stg -40 to +125 c operating temperature t a -40 to +125 c sensing element thin film temperature compensation and gain stage #1 gain stage #2 and ground reference shift circuitry v s v out gnd pins 4, 5, and 6 are no connects for unibody device pins 1, 5, 6, 7, and 8 are no connects for small outline package device
mpx5050 sensors freescale semiconductor 5 pressure on-chip temperature comp ensation and calibration figure 3 illustrates the differential/gauge sensing chip in the basic chip carrier (case 867). a fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. the mpx5050/mpxv5050g se ries pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. media, other than dry air, may have adverse effects on sensor performance and long-term reliability. contact the factory for information regarding media compatibility in your application. figure 2 shows the sensor output signal relative to pressure input. typical, mi nimum, and maximum output curves are shown for operation over a temperature range of 0 to 85c using the decoupling circuit shown in figure 4 . the output will saturate outside of the specified pressure range. figure 4 shows the recommended decoupling circuit for interfacing the output of the int egrated sensor to the a/d input of a microprocessor or microc ontroller. proper decoupling of the power supply is recommended. figure 2. output vs. pressure differential figure 3. cross-sectional diagram (not to scale) figure 4. recommended power supply decoupling and output filtering (for additional output filtering, plea se refer to application note an1646) differential pressure (kpa) output (v) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 5 10 15 20 25 30 35 40 45 55 50 transfer function: v out = v s *(0.018*p+0.04) error v s = 5.0 vdc temp = 0 to 85c typical min max fluorosilicone gel die coat wire bond die p1 stainless steel metal cover lead frame die bond epoxy plastic case p2 differential/gauge element +5 v 1.0 f 0.01 f 470 pf gnd v s v out ips output
mpx5050 sensors 6 freescale semiconductor pressure pressure (p1)/vacuum (p2) side identification table freescale designates the two si des of the pressure sensor as the pressure (p1) side and the vacuum (p2) side. the pressure (p1) side is the side containing fluorosilicone gel which protects the die from harsh media. the mpx pressure sensor is designed to operat e with positive differential pressure applied, p1 > p2. the pressure (p1) side may be identified by using the table below: nominal transfer value: v out = v s (p x 0.018 + 0.04) (pressure error x temp. factor x 0.018 x v s ) v s = 5.0 v 0.25 vdc transfer function temp multiplier ?40 3 0 to 85 1 +125 3 temperature in c 4.0 3.0 2.0 0.0 1.0 ?40 ?20 0 20 40 60 140 120 100 80 temperature error factor note: the temperature multiplier is a linear response from 0 to ?40c and from 85 to 125c. temperature error band pressure error (max) pressure error band 0 to 50 (kpa) 1.25 (kpa) error limits for pressure pressure (in kpa) 3.0 2.0 1.0 ?1.0 ?2.0 ?3.0 0.0 01020304050 60 pressure error (kpa) part number case type pressure (p1) side identifier mpx5050d 867 stainless steel cap mpx5050dp 867c side with part marking mpx5050gp 867b side with port attached MPXV5050GP 1369 side with port attached mpxv5050dp 1351 side with part marking mpxv5050gc6u/t1 482a vertical port attached
mpx5050 sensors freescale semiconductor 7 pressure package dimensions case 482a-01 issue a unibody package case 867-08 issue n unibody package dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 12.70 0.520 0.500 13.21 d 0.96 0.042 0.038 1.07 g 0.100 bsc 2.54 bsc h 0.002 0.010 0.05 0.25 j 0.009 0.011 0.23 0.28 k 0.061 0.071 1.55 1.80 m 0 7 0 7 n 0.444 0.448 11.28 11.38 s 0.709 0.725 18.01 18.41 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5 typical draft. s d g 8 pl 4 5 8 1 s b m 0.25 (0.010) a s t ?a? ?b? c m j k pin 1 identifier h seating plane ?t? n v w v 0.245 0.255 6.22 6.48 w 0.115 0.125 2.92 3.17 pin 1 f g n l r 123456 6 pl d seating plane -t- m a m 0.136 (0.005) t positive pressure (p1) c b m j s -a- style 1: pin 1. vout 2. ground 3. vcc 4. v1 5. v2 6. vex style 3: pin 1. open 2. ground 3. +vout 4. +vsupply 5. -vout 6. open style 2: pin 1. open 2. ground 3. -vout 4. vsupply 5. +vout 6. open max millimeters inches 16.00 13.56 5.59 0.84 1.63 0.100 bsc 2.54 bsc 0.40 18.42 30? nom 30? nom 12.57 11.43 dim a b c d f g j l m n r s min 0.595 0.514 0.200 0.027 0.048 0.014 0.695 0.475 0.430 0.090 max 0.630 0.534 0.220 0.033 0.064 0.016 0.725 0.495 0.450 0.105 min 15.11 13.06 5.08 0.68 1.22 0.36 17.65 12.07 10.92 2.29 2.66 notes: 1. 2. 3. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. dimension -a- is inclusive of the mold stop ring. mold stop ring not to exceed 16.00 (0.630).
mpx5050 sensors 8 freescale semiconductor pressure package dimensions case 867b-04 issue g unibody package page 1 of 2
mpx5050 sensors freescale semiconductor 9 pressure package dimensions case 867b-04 issue g unibody package page 2 of 2
mpx5050 sensors 10 freescale semiconductor pressure package dimensions case 867c-05 issue f unibody package notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. style 1: pin 1. v out 2. ground 3. v cc 4. v1 5. v2 6. v ex r x 123456 dim min max min max millimeters inches a 1.145 1.175 29.08 29.85 b 0.685 0.715 17.40 18.16 c 0.405 0.435 10.29 11.05 d 0.027 0.033 0.68 0.84 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc j 0.014 0.016 0.36 0.41 k 0.695 0.725 17.65 18.42 l 0.290 0.300 7.37 7.62 n 0.420 0.440 10.67 11.18 p 0.153 0.159 3.89 4.04 q 0.153 0.159 3.89 4.04 r 0.063 0.083 1.60 2.11 s u 0.910 bsc 23.11 bsc v 0.182 0.194 4.62 4.93 w 0.310 0.330 7.87 8.38 x 0.248 0.278 6.30 7.06 port #2 vacuum (p2) port #1 positive port #1 pin 1 port #2 positive vacuum pressure seating plane seating plane ?t? ?t? p g c j n b f d w v l u 6 pl s k ?q? ?a? m q m 0.25 (0.010) t m a m 0.13 (0.005) pressure (p1) 0.220 0.240 5.59 6.10 (p1) (p2)
mpx5050 sensors freescale semiconductor 11 pressure package dimensions case 1351-01 issue a small outline package page 1 of 2
mpx5050 sensors 12 freescale semiconductor pressure package dimensions case 1351-01 issue a small outline package page 2 of 2
mpx5050 sensors freescale semiconductor 13 pressure package dimensions case 1369-01 issue b small outline package page 1 of 2
mpx5050 sensors 14 freescale semiconductor pressure package dimensions case 1369-01 issue b small outline package page 2 of 2
mpx5050 sensors freescale semiconductor 15 pressure package dimensions case 1560-03 issue d small outline package page 1 of 3
mpx5050 sensors 16 freescale semiconductor pressure package dimensions case 1560-03 issue d small outline package page 2 of 2 page 2 of 3
mpx5050 sensors freescale semiconductor 17 pressure package dimensions case 1560-03 issue d small outline package page 3 of 3
mpx5050 rev. 11 03/2010 how to reach us: home page: www.freescale.com web support: http://www.freescale.com/support usa/europe or locations not listed: freescale semiconductor, inc. technical information center, el516 2100 east elliot road tempe, arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support europe, middle east, and africa: freescale halbleiter deutschland gmbh technical information center schatzbogen 7 81829 muenchen, germany +44 1296 380 456 (english) +46 8 52200080 (english) +49 89 92103 559 (german) +33 1 69 35 48 48 (french) www.freescale.com/support japan: freescale semiconductor japan ltd. headquarters arco tower 15f 1-8-1, shimo-meguro, meguro-ku, tokyo 153-0064 japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com asia/pacific: freescale semiconductor china ltd. exchange building 23f no. 118 jianguo road chaoyang district beijing 100022 china +86 10 5879 8000 support.asia@freescale.com for literature requests only: freescale semiconductor lite rature distribution center 1-800-441-2447 or +1-303-675-2140 fax: +1-303-675-2150 ldcforfreescalesemiconductor@hibbertgroup.com information in this document is provided solely to enable system and software implementers to use freescale semiconduc tor products. there are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. freescale semiconductor reserves the right to make changes without further notice to any products herein. freescale semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does freescale semiconductor assume any liability ar ising out of the application or use of any product or circuit, and specifically discl aims any and all liability, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale semiconductor data s heets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals?, must be validated for each customer application by customer?s technical experts. freescale se miconductor does not convey any license under its patent rights nor the rights of others. freescale semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the fa ilure of the freescale semiconductor product could create a situation where personal injury or death may occur. should buyer purchase or use freescale semiconductor products for any such unintended or unauthorized application, buyer shall indemni fy and hold freescale semiconductor and its officers, employees, subsidiaries, affili ates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that freescale semiconductor was negligent regarding the design or manufacture of the part. freescale? and the freescale logo are trademarks of freescale semiconductor, inc., reg. u.s. pat. & tm. off. all other produc t or service names are the property of their respective owners. ? freescale semiconductor, inc. 2010. all rights reserved.

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